Solid-state image pickup device and method of manufacturing...

Details Solid-state image pickup device and method of manufacturing... Solid-state image pickup device and method of manufacturing...

2011-07-12

2011-07-12

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S060000, C438S070000, C438S075000, C438S144000, C438S401000, C438S459000, C438S469000, C257S459000, C257SE21158, C257SE31124, C257SE31022, C257SE31131, C257SE31131, C257SE31131, C257SE31131, C257SE31131, C257SE31131, C257SE31097, C257SE27013, C257SE27134, C257SE27133, C257SE27135

Reexamination Certificate

active

07977141

ABSTRACT:
A method of manufacturing a solid-state image pickup device according to an embodiment includes forming first and second holes in a semiconductor substrate, forming insulating films on surfaces of the first and second holes, forming a contact and an alignment mark by embedding a conducting material in the first and second holes, forming a photodiode in the semiconductor substrate, forming a wiring layer including a connecting part for connecting to the contact and a wiring for connecting to the connecting part, bonding a supporting substrate on the wiring layer, exposing the contact and the alignment mark on the surface of the semiconductor substrate by reducing the semiconductor substrate in thickness, and forming a filter and a lens on the photodiode based on the alignment mark.

REFERENCES:
patent: 2005/0104148 (2005-05-01), Yamamoto et al.
patent: 2006/0197007 (2006-09-01), Iwabuchi et al.
patent: 2008/0237762 (2008-10-01), Swain et al.
patent: 2009/0057539 (2009-03-01), Iwabuchi et al.
patent: 2009/0065681 (2009-03-01), Iwabuchi et al.
patent: 2005-150463 (2005-06-01), None
patent: 2007-13089 (2007-01-01), None

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