Solid-state image pickup device and fabrication method thereof

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S075000, C257SE21185, C257SE21189, C257SE21458, C257SE21617

Reexamination Certificate

active

07125740

ABSTRACT:
A method of fabricating a solid-state image pickup device comprising forming mask patterns corresponding to patterns of first and third transfer electrodes, which are to be alternately arranged in each vertical transfer register formation region and which are to extend in parallel to each other between light receiving portions adjacent to each other in the vertical direction, on a first electrode material layer. The method also includes forming side walls on each of the mask patterns. The method further includes patterning the first electrode material layer via the mask patterns having the side walls, to form first and third transfer electrodes formed by the first layer. The method yet further includes forming second transfer electrodes by a second electrode material layer via an insulating film in such a manner that each of said second transfer electrodes is disposed between the first and third transfer electrodes of the first layer in said vertical transfer register formation region and between the light receiving portions. The method still further includes forming fourth transfer electrodes by a third electrode material layer via an insulating film in such a manner that each of the fourth transfer electrodes is between the third and first transfer electrodes of the first layer in the vertical transfer register formation region and between the light receiving portions.

REFERENCES:
patent: 5324669 (1994-06-01), Kuroda et al.
patent: 5401679 (1995-03-01), Fukusho
patent: 5731601 (1998-03-01), Shioyama et al.
patent: 5742081 (1998-04-01), Furumiya
patent: 5895944 (1999-04-01), Yamada

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Solid-state image pickup device and fabrication method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solid-state image pickup device and fabrication method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solid-state image pickup device and fabrication method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3636765

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.