Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2001-02-13
2003-12-16
Zarabian, Amir (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S116000, C438S118000
Reexamination Certificate
active
06664125
ABSTRACT:
This application is based on the Japanese Patent Application 2000-054551, filed on Feb. 29, 2000, all the content of which is incorporated herein by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a solid-state image pickup device and a method of manufacturing the same, and in particular, to a solid-state image pickup device and a method of manufacturing the same in which a solid-state image pickup element is attached to a package with high precision.
2. Description of the Related Art
With an increasing need of higher picture quality for a digital video camera of integrated type and a digital still camera, research and development of a solid-state image pickup element for use with a solid-state image pickup device have been carried out for fine structure and high integration thereof. A need for an optical system is also highly increased, namely, an image must exactly focused on an image-pickup plane of the solid-state image pickup element.
FIG. 8
shows a general configuration of a solid-state image pickup device in a cross section.
In
FIG. 8
, a solid-state image pickup device X includes a package
101
in a contour of a box and a solid-state image pickup element
103
housed in the package
101
.
As can be seen from
FIG. 8
, the package
101
includes a bottom plate
101
a
and a sidewall section
101
b
rising from a peripheral section of the bottom plate
101
a
. The configuration defines an opening section
101
c
formed in an upper section of the package
101
and a housing section
101
d
surrounded by the bottom plate
101
a
and the side wall section
101
b
to house the image pickup element
103
.
The image pickup element
103
is installed in the housing section
101
d
. The image pickup element
103
is connected via bonding wires
107
to lead wires of the package
101
.
The opening section
101
c
of the package
101
is covered with a transparent shield plate
111
placed on an upper surface
101
e
of the side wall section
101
b.
The solid-state image pickup device
103
ha a rear surface fixedly attached to the housing section
101
d
by adhesive
115
.
FIG. 9
is a cross-sectional view to explain a method of manufacturing a solid-state image pickup device.
As shown in
FIG. 9
, a package
101
on a carrier
123
is transported (to a predetermined position). The carrier
123
has an opening below the package
101
.
A package stage
121
made of iron-based material is moved upward through the opening to mount the package
101
on the stage
121
. The stage
121
has a stage adsorbing hole
121
a
to fix the package
101
on the stage
121
. The hole
121
a
produces a state like vacuum by sucking air to adsorb the rear surface of the package
101
on the package stage
121
.
The housing section
101
d
of the package
101
is coated with adhesive
115
. In the state, the solid-state image pickup element
103
is supported by a collet
125
and is placed at a predetermined position in the housing section
101
d.
The collet
125
has an adsorbing hole
125
a
which adsorbs the solid-state image pickup element
103
to fixedly support the element
103
. The collet
125
with the element
103
is moved downward to be pressed against the adhesive
115
to install the solid-state image pickup element
103
on the housing section
101
d
of the package
101
. The adhesive
115
between the element
103
and the package
101
is cured or hardened by heat to fix the element
103
in the package
101
.
After a wire bonding process is conducted for the objective item, the upper opening section of the package
101
is covered by a shield plate to completely manufacture a solid-state image pickup device.
FIG. 10
shows in a schematic cross-sectional view a configuration of an image pickup device including a solid-state image pickup device and an optical system including a lens.
As shown in
FIG. 10
, an image pickup device Y includes a solid-state image pickup device X, a solid-state image pickup device fixing member
131
, an image pickup lens body tube
133
, and an image pickup lens
135
.
The fixing member
131
supports a bottom surface of the package
101
. The lens body tube
133
in a cylindrical shape is formed on a peripheral edge section of the fixing member
131
. On an inner circumferential section
133
a
of the body tube
133
, an upper engaging section
133
b
and a lower engaging section
133
c
are formed to support the image pickup lens
135
. The upper and lower engaging section
133
b
and
133
c
fixedly support the lens
135
.
As the adhesive to fix the solid-state image pickup element on the package, there has been used thermosetting adhesive such as silver paste or resin-based adhesive. The silver paste has a high reflection factor for light and is therefore not suitable as adhesive for a solid-state image pickup element. Consequently, resin-based adhesive has been increasingly used.
However, in a solid-state image pickup device including photo diodes in a fine structure, there arises a problem that resolution of the solid-state image pickup device deviates or fluctuates within a chip area of a solid-state image pickup device.
To increase picture quality of a digital video camera of integrated type and a digital still camera, only miniaturizing structure of photo diodes and the like is insufficient. To improve picture quality of a camera or the like, it is essential how to exactly adjust focus of an image pickup lens of a camera onto a light receiving plane of each photo diode formed in fine structure.
For this purpose, it is required to improve precision of tilt of image in a light receiving plane (parallelism of the light receiving plane with respect to the optical system).
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a technique to reduce fluctuation of the tilt angle of image in a solid-state image pickup element to increase picture quality of a camera or the like using the element.
According to one aspect of the present invention, there is provided a method of manufacturing a solid-state image pickup device comprising the steps of preparing a package including a housing section to house a solid-state image pickup element chip and an opening section in an upper section thereof, sporadically applying adhesive with a predetermined thickness on a bottom surface of the housing section, moving the solid-state image pickup element toward the housing section, an upper surface of the package and an upper surface of the element each having desired parallelism with respect to a predetermined reference surface with high precision, bringing a rear surface of the solid-state image pickup element into contact with the adhesive and stopping the movement of the element before the element comes into contact with the bottom surface of the housing section, and curing the adhesive while the solid-state image pickup element is floating on the adhesive and fixing the element in the housing section.
According to the present invention, there is provided a method of manufacturing a solid-state image pickup device, comprising the steps of preparing a package including a bottom plate and a side wall rising from the bottom plate to house a solid-state image pickup element chip, sporadically applying adhesive with a predetermined thickness on the bottom plate of the package, setting an upper surface of the side wall or an upper surface of the bottom plate as a reference plane, bringing a rear surface of the solid-state image pickup element into contact with the adhesive with parallelism adjusted with high precision between the upper surface of the element and the reference plane, moving the solid-state image pickup element, the rear surface of the element depressing the adhesive, the rear surface of the element not coming into contact with the upper surface of the bottom plate and curing the adhesive and fixing the solid-state image pickup element in the package.
According to the present invention, there is provided a package comprising a bottom plate, a side wall rising from s
Nishida Takeshi
Watanabe Eiji
Arent Fox Kintner & Plotkin & Kahn, PLLC
Brophy Jamie L.
Fuji Photo Film Co. , Ltd.
Zarabian Amir
LandOfFree
Solid-state image pickup device and a method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solid-state image pickup device and a method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solid-state image pickup device and a method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3176962