Solid state gamma camera module and integrated thermal...

Details Solid state gamma camera module and integrated thermal... Solid state gamma camera module and integrated thermal...

2005-07-26

2005-07-26

Hannaher, Constatine (Department: 2878)

Radiant energy

Invisible radiant energy responsive electric signalling

Semiconductor system

Reexamination Certificate

active

06921904

ABSTRACT:
A solid state gamma camera module and integrated thermal management method thereof includes a printed circuit board having a first thermal layer and a second thermal layer. The first thermal layer is thermally and/or electrically bonded to the second thermal layer. A semiconductor detector module having the temperature sensitive material electrically communicates with the second thermal layer. A plurality of the integrated circuits each having a bottom metal layer and wire bonds are electrically connected to the first thermal layer. A cover is electrically and thermally bonded to the first thermal layer and covers the plurality of integrated circuits. The first thermal layer extracts heat from the integrated circuits by direct interface to the bottom metal layer (or the second thermal layer), and the second thermal layer extracts heat from an integrated circuit (IC) interconnect. The IC interconnect can be through a wire bond, die bond, direct solder flip chip attachment or the like. Accordingly, heat generated by the integrated circuits is removed while heat flow to the temperature sensitive material is reduced.

REFERENCES:
patent: 4292645 (1981-09-01), Schlosser et al.
patent: 5132542 (1992-07-01), Bassalleck et al.
patent: 6465790 (2002-10-01), Monnet et al.
patent: 6510195 (2003-01-01), Chappo et al.
patent: 6621084 (2003-09-01), Amrami et al.

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