Patent
1981-12-07
1984-03-20
James, Andrew J.
357 65, 357 67, 357 71, H01L 2348, H01L 2944, H01L 2946, H01L 2962
Patent
active
044384505
ABSTRACT:
Aluminum electrically conducting patterns for integrated circuits are achieved with narrow lines and unexpectedly-high electromigration characteristics by making the crystal grains of the pattern into a chain-shaped structure with {111} orientation. A process for achieving the structure is also described.
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IBM Technical Disclosure Bulletin; Aluminum Land Metallurgy with Copper on the Surface; by Daley, vol. 13, No. 6, Nov. 1970, p. 1735.
IBM Technical Disclosure Bulletin; Improving the Resistance to Electromigration of Al-Cu Stripes; by D'Heurle; vol. 13, No. 9, Feb. 1971, p. 2492.
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Sheng Tan T.
Sinha Ashok K.
Vaidya Sheila
Bell Telephone Laboratories Incorporated
James Andrew J.
Nehrbass Seth
Shapiro Herbert M.
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