Solid state device package mounting apparatus

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

165 803, 165185, 174 163, 357 79, 357 81, 361389, 363141, H05K 720

Patent

active

048538280

ABSTRACT:
Apparatus for mounting TO-220 solid state device packages on a heat sink. Each package includes an electrically conductive, heat dissipating, heat sinking tab which is common with one of the electrical terminals, and a resin case. The heat sinking tab includes an opening therethrough intended to be used in mounting the package to a heat sink. The apparatus comprises a printed circuit board mounted to the heat sink. An opening is provided in the board. The devices are adapted to be oriented during mounting so that they overlie the opening with their heat sinking tab sides facing toward the opening and their resin case sides facing away from the opening. A first bar of thermally conductive material is adapted to be positioned between the heat sink and the heat sinking tab sides of the packages and extending through the opening. A layer of electrically insulative and thermally conductive material is interposed between the bar and the heat sinking tab sides of the packages. A second bar of thermally conductive material is provided. Aligned passageways are provided through the second bar, the layer of electrically insulative and thermally conductive material, the first bar and the heat sink. Screws are positioned in the aligned openings but not so that the screws extend into the openings through the heat sinking tabs for clamping the packages in heat sinking orientation between the second bar and the layer of electrically insulative and thermally conductive material.

REFERENCES:
patent: 3697814 (1972-10-01), Christman et al.
patent: 4254301 (1981-03-01), Serino
patent: 4266267 (1981-05-01), Ruegg
patent: 4342068 (1982-07-01), Kling
patent: 4546408 (1985-10-01), Rodseth et al.
patent: 4599680 (1986-07-01), Gibson et al.

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