Solid phase water scrub for defect removal

Details Solid phase water scrub for defect removal Solid phase water scrub for defect removal

1999-01-19

2000-10-24

Eley, Timothy V.

Abrading

Abrading process

Utilizing nonrigid tool

451 36, B24B 100

Patent

active

061358649

ABSTRACT:
A system and method for using solid-phase water scrub to remove defects from a wafer surface is disclosed. The method includes the steps of placing the wafer proximate to a frozen substrate and moving the wafer relative to the frozen substrate, thereby causing a portion of the frozen substrate to liquefy. As a result, defects are effectively removed from the wafer's surface.

REFERENCES:
patent: 5283989 (1994-02-01), Hisasue et al.
patent: 5348615 (1994-09-01), Gupta

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