Solid phase bonding method

Details Solid phase bonding method Solid phase bonding method

1994-04-06

1996-07-16

Barry, Chester T.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562731, 1562733, 1562735, 1562739, 1562744, B32B 3100

Patent

active

055363547

ABSTRACT:
A solid phase junction method using a simpler process for accurately bonding solid phases without operating in an ultra-high vacuum. This method for bonding at least two solid members includes a step (A) of forming at least one of i) a monomolecular film; and ii) a monomolecular built-up film on at least one of the two junction surfaces, a step (B) of adhering the members through the junction surfaces, a step (C) of applying an electric field to the junction surfaces, and, if necessary, a step (D) of heating the junction surfaces or a step (E) of irradiating the junction surfaces with laser light.

REFERENCES:
patent: 5208111 (1993-05-01), Decher et al.
patent: 5368942 (1994-11-01), Smith et al.

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