Solid interface module

Details Solid interface module Solid interface module

2000-06-16

2001-12-04

Wong, Don (Department: 2821)

Metal working

Method of mechanical manufacture

Electrical device making

C257S706000, C029S830000

Reexamination Certificate

active

06324755

ABSTRACT:

STATEMENTS REGARDING FEDERALLY SPONSORED RESEARCH
Not applicable.
BACKGROUND OF THE INVENTION
As known to one of ordinary skill in the art, there has been a trend to provide increasingly complex radar and communications systems and circuits including radio frequency (RF) circuits such as transmit-receive modules. There has also been a trend to provide such systems, circuits and modules as compact, low cost systems, circuits and modules.
Conventional radar systems include array antenna systems utilizing a variety of different RF, digital and power conditioning and supply circuitry. Such circuitry typically includes, but is not limited to, transmit/receive (TR) modules, data multiplexer/demultiplexer (MUX-DEMUX) modules and DC-DC converter modules. The number of circuits or modules used in such systems results in a large number of interconnections between modules, circuits and devices. Consequently, the systems are typically large, time consuming to assemble, and expensive. This is particularly true with respect to a class of radar systems that include active electronically scanned antenna systems (AESA).
As is understood by one of ordinary skill in the art, the transmit/receive modules are an important component of an AESA system. In general , the T/R modules arc quite significant in determining radar microwave performance, cost, and interface requirements. For example, conventional T/R modules have relatively high assembly costs, are labor intensive to assemble, have limited yield rates, have significant interconnection losses, are subject to cross coupling, and have significant thermal management considerations.
It would, therefore, be desirable to provide a radar system having transmit/receive modules in the form of a solid interface module having a ball grid array structure that integrates microwave, logic and thermal connections.
SUMMARY OF THE INVENTION
The present invention provides a microwave transmit/receive (TR) assembly in the form of a solid interface module having an integrated structure that provides a relatively connector-less interface with a module on which the solid interface module is disposed. While the solid interface module of the present invention is particularly well-suited for radar systems, especially active electronically scanned antenna radar systems, it is understood that the invention is applicable in other electronic systems that utilize RF, logic and bias circuits.
In one aspect of the invention, a solid interface module in accordance with the present invention includes a substrate with a microwave circuit, a logic circuit, and a DC bias circuit disposed on the substrate. In one embodiment, the substrate is formed from Beryllium Oxide. With this particular arrangement, a microwave solid interface module having a variety of different types of circuit technologies integrated on a single substrate is provided for reducing the number of separate substrates and carrier assemblies required to provide the transmit/receive module.
In accordance with a further aspect of the present invention, the solid interface module has a ball grid array structure including a via interconnection system. In one embodiment, via structures extend from solder balls of the ball grid array to a respective layer within a module that supports the solid interface module. A portion of the vias are thermal vias that can extend from a solder ball of the ball grid array to a thermally conductive core disposed within the supporting module. The thermal vias can extend from a region of the substrate that corresponds to a location of a high power circuit, such as a power amplifier.
In another aspect of the invention, the via interconnection system includes a substantially round via hole and a substantially square pin. The pins can be coated with solder for reflowing of the solder after insertion of the pin into the via hole. This arrangement enhances the electrical or thermal pathway from the solid interface module to the supporting module.


REFERENCES:
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patent: 5132648 (1992-07-01), Trinh et al.
patent: 5239685 (1993-08-01), Moe et al.
patent: 5819401 (1998-10-01), Johannes et al.
patent: 5832598 (1998-11-01), Greenman et al.
patent: 6011446 (2000-01-01), Woods
patent: 6019165 (2000-02-01), Batchelder

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