Solid imaging method utilizing compositions comprising thermally

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 36, 427 531, 427 541, 427 55, 427264, 427265, 427375, 4273855, 4274071, B05D 306

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050063642

ABSTRACT:
A solid imaging method utilizing photoformable compositions comprising thermally coalescible materials for producing multilayer models and prototypes having improved structural properties and resolution.

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Kodama, Hideo; Rev. Sci, Instrum. 52(11), 1770-1773, Nov. 1981.
Herbert, Alan J.; Journal of Applied Photographic Engineering, 8(4), 185-188, Aug. 1982.

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