Solid explosive composition

Details Solid explosive composition Solid explosive composition

1987-03-10

1988-02-02

Lechert, Jr., Stephen J.

Explosive and thermic compositions or charges

Structure or arrangement of component or product

149 21, 149 36, 149 47, 149 55, 149 56, 149 61, 149 62, 149 69, 149 70, 149 75, 149 76, 149 77, 149 83, 149 85, 149 88, 149 92, 149105, 149 45, C06B 4500

Patent

active

047227575

ABSTRACT:
This invention provides a solid explosive composition comprising a low-water content melt-in-fuel emulsion when prepared at elevated temperature which solidifies on cooling. The emulsion comprises a continuous phase containing water immiscible fuel and emulsifier and a discontinuous phase containing oxidizer salt. A particulate material effective as a nucleating agent is incorporated in the composition to reduce supercooling of the discontinuous phase and to accelerate crystallization of the oxidizer salt.
The particulate nucleating agent is preferably colloidal solid particles for example silica or an insoluble salt of aluminium, calcium or barium, which salt may optionally be formed in situ by a double decomposition reaction.
The presence of the nucleating agent to accelerate crystallization of the oxidizer enhances the proportion of discrete droplets which remain totally encapsulated in the solidified composition and enables solid products to be obtained from relatively low melting oxidizer salts melts.

REFERENCES:
patent: 4525225 (1985-06-01), Cechanski
patent: 4600450 (1986-07-01), Jessop et al.
patent: 4600451 (1986-07-01), Jessop et al.
patent: 4600452 (1986-07-01), Jessop et al.
patent: 4632714 (1986-12-01), Abegg et al.

Affiliated with

Also associated with

Rating

Solid explosive composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solid explosive composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solid explosive composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1634747