Metal working – Barrier layer or semiconductor device making – Barrier layer device making
Reexamination Certificate
2011-05-10
2011-05-10
Ghyka, Alexander G (Department: 2812)
Metal working
Barrier layer or semiconductor device making
Barrier layer device making
Reexamination Certificate
active
07938866
ABSTRACT:
A method for forming an electrolytic capacitor is disclosed. The method includes forming a conductive polymer coating over the dielectric layer by polymerizing a monomer in the presence of an oxidative polymerization catalyst. The conductive polymer coating is formed by dipping the anode in a polymerization solution comprising the monomer, the oxidative polymerization catalyst, and a polar solvent. The polymerization solution has a temperature of less than about 20° C. Cooling the polymerization solution further stabilizes the polymerization solution and prevents premature polymerization of the monomer(s). Thus, the resulting conductive polymer layer can be more intimately positioned with respect to the anode. As a result, the formed capacitor can exhibit better performance.
REFERENCES:
patent: 3345545 (1967-10-01), Bourgualt et al.
patent: 3653959 (1972-04-01), Kehr et al.
patent: 4085435 (1978-04-01), Galvagni
patent: 4609971 (1986-09-01), Shaffer
patent: 4785380 (1988-11-01), Harakawa et al.
patent: 4794491 (1988-12-01), Saiki
patent: 4805074 (1989-02-01), Harakawa et al.
patent: 4910645 (1990-03-01), Jonas et al.
patent: 4934033 (1990-06-01), Harakawa et al.
patent: 4945452 (1990-07-01), Sturmer et al.
patent: 4959430 (1990-09-01), Jonas et al.
patent: 5005107 (1991-04-01), Kobashi et al.
patent: 5017272 (1991-05-01), Kamigawa
patent: 5071521 (1991-12-01), Kojima et al.
patent: 5119274 (1992-06-01), Kinuta et al.
patent: 5135618 (1992-08-01), Saiki et al.
patent: 5187650 (1993-02-01), Kudoh et al.
patent: 5198968 (1993-03-01), Galvagni
patent: 5357399 (1994-10-01), Salisbury
patent: 5394295 (1995-02-01), Galvagni et al.
patent: 5424907 (1995-06-01), Kojima et al.
patent: 5436796 (1995-07-01), Abe et al.
patent: 5457862 (1995-10-01), Sakata et al.
patent: 5473503 (1995-12-01), Sakata et al.
patent: 5495386 (1996-02-01), Kulkarni
patent: 5586000 (1996-12-01), Sakata et al.
patent: 5729428 (1998-03-01), Sakata et al.
patent: 5812367 (1998-09-01), Kudoh et al.
patent: 5914852 (1999-06-01), Hatanaka et al.
patent: 5949639 (1999-09-01), Maeda et al.
patent: 6001281 (1999-12-01), Lessner
patent: 6128180 (2000-10-01), Araki et al.
patent: 6154358 (2000-11-01), Fukaumi et al.
patent: 6191936 (2001-02-01), Webber et al.
patent: 6197252 (2001-03-01), Bishop et al.
patent: 6322912 (2001-11-01), Fife
patent: 6369239 (2002-04-01), Rauchschwalbe et al.
patent: 6430033 (2002-08-01), Mitsui et al.
patent: 6519135 (2003-02-01), Sano et al.
patent: 6519137 (2003-02-01), Nitta et al.
patent: 6528662 (2003-03-01), Jonas
patent: 6580601 (2003-06-01), Hamada et al.
patent: 6616713 (2003-09-01), Sano et al.
patent: 6674635 (2004-01-01), Fife et al.
patent: 6756473 (2004-06-01), Reuter et al.
patent: 6771488 (2004-08-01), Takagi et al.
patent: 6864147 (2005-03-01), Fife et al.
patent: 6870727 (2005-03-01), Edson et al.
patent: 6891016 (2005-05-01), Reuter et al.
patent: 6920036 (2005-07-01), Tseng et al.
patent: 7102016 (2006-09-01), Reuter
patent: 7341801 (2008-03-01), Reuter et al.
patent: 7460358 (2008-12-01), Biler
patent: 7483259 (2009-01-01), Biler
patent: 2005/0013094 (2005-01-01), Reuter et al.
patent: 2005/0270725 (2005-12-01), Hahn et al.
patent: 2006/0050469 (2006-03-01), Anzai et al.
patent: 2006/0180797 (2006-08-01), Merker et al.
patent: 2007/0072362 (2007-03-01), Tseng et al.
patent: 0507315 (1992-10-01), None
patent: 0559109 (1993-09-01), None
patent: 0571329 (1993-11-01), None
patent: 0571329 (1993-11-01), None
Abstract of Japanese Patent No. 1253226 dated Oct. 9, 1989.
Abstract of Japanese Patent No. 2219211 dated Aug. 31, 1990.
Abstract of Japanese Patent No. 2238613 dated Sep. 20, 1990.
Abstract of Japanese Patent No. 2249221 dated Oct. 5, 1990.
Abstract of Japanese Patent No. 3034303 dated Feb. 14, 1991.
Abstract of Japanese Patent No. 3046215 dated Feb. 27, 1991.
Abstract of Japanese Patent No. 3064013 dated Mar. 19, 1991.
Abstract of Japanese Patent No. 3072615 dated Mar. 27, 1991.
Abstract of Japanese Patent No. 3073509 dated Mar. 28, 1991.
Abstract of Japanese Patent No. 3078222 dated Apr. 3, 1991.
Abstract of Japanese Patent No. 3080522 dated Apr. 5, 1991.
Abstract of Japanese Patent No. 3093216 dated Apr. 18, 1991.
Abstract of Japanese Patent No. 3093217 dated Apr. 18, 1991.
Abstract of Japanese Patent No. 3096210 dated Apr. 22, 1991.
Abstract of Japanese Patent No. 3167816 dated Jul. 19, 1991.
Abstract of Japanese Patent No. 3183111 dated Aug. 9, 1991.
Abstract of Japanese Patent No. 3280523 dated Dec. 11, 1991.
Abstract of Japanese Patent No. 3285321 dated Dec. 16, 1991.
Abstract of Japanese Patent No. 4025009 dated Jan. 28, 1992.
Abstract of Japanese Patent No. 4034915 dated Feb. 5, 1992.
Abstract of Japanese Patent No. 4042912 dated Feb. 13, 1992.
Abstract of Japanese Patent No. 4044305 dated Feb. 14, 1992.
Abstract of Japanese Patent No. 4048710 dated Feb. 18, 1992.
Abstract of Japanese Patent No. 4053115 dated Feb. 20, 1992.
Abstract of Japanese Patent No. 4073924 dated Mar. 9, 1992.
Abstract of Japanese Patent No. 4111407 dated Apr. 13, 1992.
Abstract of Japanese Patent No. 4206811 dated Jul. 28, 1992.
Abstract of Japanese Patent No. 4307915 dated Oct. 30, 1992.
Abstract of Japanese Patent No. 4315412 dated Nov. 6, 1992.
Abstract of Japanese Patent No. 4315413 dated Nov. 6, 1992.
Abstract of Japanese Patent No. 5047604 dated Feb. 26, 1993.
Abstract of Japanese Patent No. 5129160 dated May 25, 1993.
Abstract of Japanese Patent No. 5136006 dated Jun. 1, 1993.
Abstract of Japanese Patent No. 5152169 dated Jun. 18, 1993.
Abstract of Japanese Patent No. 5159983 dated Jun. 25, 1993.
AVX Corporation
Dority & Manning P.A.
Ghyka Alexander G
Nikmanesh Seahvosh J
LandOfFree
Solid electrolytic capacitor containing a conductive polymer does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solid electrolytic capacitor containing a conductive polymer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solid electrolytic capacitor containing a conductive polymer will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2692932