Solid composition comprising an amphoteric surfactant, a process

Details Solid composition comprising an amphoteric surfactant, a process Solid composition comprising an amphoteric surfactant, a process

1997-11-21

2000-06-27

Gupta, Yogendra

Cleaning compositions for solid surfaces, auxiliary compositions

Cleaning compositions or processes of preparing

Liquid composition

510137, 510445, 510488, 510535, C11D 190, C11D 194

Patent

active

060807148

ABSTRACT:
The invention relates to a solid composition comprising a hygroscopic amphoteric surfactant and a fatty acid which is substantially free from other detergents and/or detergent additives. Preferably, the fatty acid is a linear, saturated C.sub.6 -C.sub.22 acid. The weight ratio of amphoteric surfactant to fatty acid in said composition preferably is from 4:1 to 1:2. Examples of amphoteric surfactants include amine oxides and betaines. The solid composition of the invention may be shaped into a particulate form, such as granules. The invention further pertains to a process for preparing said composition and to the use of same, for example, in soap bars.

REFERENCES:
patent: 3202714 (1965-08-01), Zimmerer et al.
patent: 4511513 (1985-04-01), Guth et al.
patent: 5055233 (1991-10-01), Borland et al.
patent: 5389306 (1995-02-01), Wierenga et al.
patent: 5399296 (1995-03-01), Wierenga et al.
Amphoteric Surfactants, 2nd. ed., E. G. Lomax, Ed. 1996, Marcel Dekker, pp. 312-313.
Handbook of Chemistry and Physics, 58th Edition 1977-1978, CRC Press, pp. D216-D217.
Abstract, JO 4049218-A, Feb. 2, 1992.

Affiliated with

Also associated with

Rating

Solid composition comprising an amphoteric surfactant, a process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solid composition comprising an amphoteric surfactant, a process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solid composition comprising an amphoteric surfactant, a process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1784790