Solid chip capacitor and method of manufacture

Details Solid chip capacitor and method of manufacture Solid chip capacitor and method of manufacture

1979-06-11

1981-09-08

James, Andrew J.

Electricity: electrical systems and devices

Miscellaneous

357 72, 29570, 29589, H01L 2328, H01G 900, B01J 1700

Patent

active

042888425

ABSTRACT:
A polarized chip capacitor is encapsulated within an insulative material which forms a substantially rectangular member. The exposed portion of the leads exit from oppositely facing, substantially vertical walls of the member. Both leads cover a lower portion of the substantially vertical wall from which they exist and a portion of the bottom of the member. The polarized capacitor rests on and is capable of being electrically connected to a substrate through the wrapped leads. A method for manufacturing a chip capacitor includes the steps of electrically connecting a lead to each the anode and cathode and then encapsulating the capacitor within an insulative material. The exposed portions of the leads are folded towards each other to substantially conform to the exterior shape of the encapsulated capacitor.

REFERENCES:
patent: 3550228 (1970-12-01), Asscher
patent: 3579813 (1971-05-01), Tomiwa
patent: 3588628 (1971-06-01), Peck
patent: 3855505 (1974-12-01), Karlik et al.
patent: 4097985 (1978-07-01), Morimoto
patent: 4107762 (1978-08-01), Shirn et al.

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