Solders

Details Solders Solders

2005-01-18

2005-01-18

Ip, Sikyin (Department: 1742)

Metal treatment

Stock

C420S560000, C420S561000, C228S180100

Reexamination Certificate

active

06843862

ABSTRACT:
A substantially lead-free solder with enhanced properties comprises from 88.5% to 93.5% tin; from 3.5% to 4.5% silver; from 2.0% to 6.0% indium; and from 0.3% to 1.0% copper. The solder may also comprise up to 0.5% of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.

REFERENCES:
patent: 5538686 (1996-07-01), Chen et al.
patent: 09-155586 (1997-06-01), None
patent: 10314980 (1998-12-01), None
patent: 11221694 (1999-08-01), None
patent: 2000141078 (2000-05-01), None
patent: 2001058286 (2001-03-01), None
patent: 9709455 (1997-03-01), None
patent: WO 9743456 (1997-11-01), None
patent: 2000018536 (2000-04-01), None
International Prelimiary Examination Report, PCT Application No. PCT/GB02/00259, Nov. 28, 2003.

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