Solderless system for retention and connection of a contact with

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

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Details

439620, 439751, 439931, H01R 2370

Patent

active

051584700

ABSTRACT:
A molded plastic circuit element such as connector (50) includes a housing (52) molded of plastic to be nonresilient and have a plurality of cavities (68) into which are inserted compliant spring portions (44) of compliant pin contacts (42), for self-retention therein by strong interference fit. The side walls of the cavities (68) are plated to a substantial thickness (70) of copper or the like equivalent to about one ounce. An assured electrical connection is formed by the compliant pin (42) with the plating material (70) without solder, the plating material remaining assuredly integral to define a gastight connection over long-term in-service use. The contacts (42) of the array can enable mating with a corresponding connector (18) while circuit paths (74) extend from the plated cavities (68) to another array of pads (90) to connect to a circuit element (20) and interconnect it with connector (18). Such a connector (110) can have two arrays of such pins in such cavities, to interconnect two circuit boards (12,20) with plated circuit paths (144) connecting associated cavities of the arrays.

REFERENCES:
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AMP Catalog No. 85-774, "Ampliflex Surface-To-Surface Resilient Connectors", Dec., 1985; AMP Incorporated, Harrisburg, Pa.

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