Solderless spring socket for printed circuit board

Details Solderless spring socket for printed circuit board Solderless spring socket for printed circuit board

1992-01-14

1992-08-04

Bradley, Paula A.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

439857, H01R 909

Patent

active

051354039

ABSTRACT:
A solderless spring socket for use in printed circuit boards is disclosed. The socket includes a first section having outwardly biased, resilient retention members for engaging a wall of a plated through hole in the circuit board to retain the socket therein. The socket further includes a second section having inwardly biased spring fingers for compressively engaging a lead from an electronic package inserted thereinto.

REFERENCES:
patent: 4585295 (1986-04-01), Ackerman
patent: 4614388 (1986-09-01), Powell
patent: 4728304 (1988-03-01), Fischer
patent: 4735575 (1988-04-01), Shaffer
patent: 4752250 (1988-06-01), Seidler
patent: 4781602 (1988-11-01), Cobaugh
"Hextite Press-Fit Sockets" pp. 2 and 3, Nov. 9, 1989, Mark Eyelet Inc.
"Zero--Profile Solderless Sockets", pp. 4 and 5, Augat Company.

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