Solderless, pushdown connectors for RF and DC

Wave transmission lines and networks – Long line elements and components – Strip type

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Details

439 65, 439 92, 439510, 333260, H01P 308

Patent

active

048167894

ABSTRACT:
A connector arrangment (13) for electrically connecting first and second microstrip structures (15,15') carrying for example RF and DC voltage values therebetween, the groundplates of the connector arrangement (13) and said microstrip structures (15,15') establishing an offset stripline arrangement, the dielectric layer of the connector arrangement (13) being substantially thicker and the dielectric constant thereof substantially lower in value than the corresponding values of the dielectric layers of said microstrip structures (15,15'), thereby enabling the metalization lines (18, 20 and 21) in the connector arrangement (13) to be relatively wide to enable effective alignment of microstrip structures (15,15') and connector arrangement (13).

REFERENCES:
patent: 3218584 (1965-11-01), Ayer
patent: 3218585 (1965-11-01), May
patent: 3270311 (1966-08-01), Deer et al.
patent: 3701964 (1972-10-01), Cronin
patent: 4116517 (1978-09-01), Selvin et al.
patent: 4143342 (1979-03-01), Cain et al.
patent: 4208642 (1980-06-01), Saunders
patent: 4255003 (1981-03-01), Berg
patent: 4349241 (1982-09-01), Juris et al.
patent: 4455537 (1984-06-01), La Prade et al.
patent: 4528530 (1985-07-01), Ketchen
IBM Bulletin, "Interconnection Devices", by J. F. Smith, vol. 9, No. 2, Jul. 1966.
Low-Noise Interconnection System for Monolithic Modules-L. T. Olson.
Bridge Connector-E. C. Uberbacher.
The Encyclopedia of Physics-Robert M. Besancon.

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