Solderless printed wiring devices

Details Solderless printed wiring devices Solderless printed wiring devices

1993-09-29

1996-11-12

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174260, 2281791, 22818021, 228198, 361808, H05K 710

Patent

active

055746292

ABSTRACT:
In a printed wiring device, the combination of a substrate having a metal-plateable member and an electrical component having a metal plateable lead connected with the metal-plateable member, the lead and the member being electrically interconnected by a metal layer plated on the lead and on the member and forming an electrically conductive path between the lead and the member.

REFERENCES:
patent: 4011980 (1977-03-01), Dvorak et al.
patent: 4339785 (1982-07-01), Ohsawa
patent: 4814944 (1989-03-01), Sagawa et al.
patent: 5019535 (1991-05-01), Wojnarowski et al.
patent: 5113580 (1992-05-01), Schroeder et al.

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