Solderless printed wiring board module and multi-module assembly

Details Solderless printed wiring board module and multi-module assembly Solderless printed wiring board module and multi-module assembly

1989-05-11

1990-06-12

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361388, 361403, 439 73, 165 803, H05K 720, H01L 2336

Patent

active

049338080

ABSTRACT:
A solderless printed wiring board module for receiving and securing surface mounted solderless electronic component carrier and electronic components without carrier upon a printed wiring board, the module also providing a heat transfer path to a surface away from the printed wiring board and the module further adaptable to electrical and mechanical attachment to similar modules placed adjacent to said module to form a multi-module assembly.

REFERENCES:
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patent: 3877064 (1975-04-01), Scheingold et al.
patent: 4342069 (1982-07-01), Link
patent: 4506938 (1985-03-01), Madden
patent: 4513353 (1985-04-01), Bakermans et al.
patent: 4574331 (1986-03-01), Smolley
patent: 4581679 (1986-04-01), Smolley
patent: 4648666 (1987-03-01), Lovell
patent: 4655524 (1987-04-01), Etzel
patent: 4658331 (1987-04-01), Berg
patent: 4676564 (1987-06-01), Mitchell, Jr.
patent: 4692790 (1987-09-01), Oyamada
patent: 4699593 (1987-10-01), Grabbe et al.
patent: 4703984 (1987-11-01), Mitchell, Jr.
patent: 4733172 (1988-03-01), Smolley
patent: 4769557 (1988-09-01), Houf et al.
patent: 4770242 (1988-09-01), Daikoku et al.
European Patent Application Publication No. 0150928-A2 Published 8/7/85 entitled "A Compliant Interconnection Device and Assembly Method of Manufacture, and of Micro Interconnection Casting".
Great Britain Patent Application No. GB 2,135,525A published 8/30/84 entitled "Heat Dissipating Chip Carrier Substrates".

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