Solderless filter mounting for header assemblies

Details Solderless filter mounting for header assemblies Solderless filter mounting for header assemblies

1980-04-21

1981-10-20

Nussbaum, Marvin L.

Wave transmission lines and networks

Coupling networks

Frequency domain filters utilizing only lumped parameters

333 12, 333183, 333185, 339147R, H01R 1906, H01R 1910, H01R 1366, H03H 701

Patent

active

042963907

ABSTRACT:
An improved solderless filter mounting for header assemblies or feedthrough connectors is described for retrofitting filtered terminals into an existing electronic circuit. Each of a plurality of terminals is provided with a filter sleeve which is soldered thereto. The filtered terminal assemblies are inserted into a header housing in a fixed array with the filters being electrically connected to a ground plane by means of a conductive rubber gasket. Rubber mounting blocks are positioned on the filters and pins to each side of the ground plane and the conductive rubber gasket and are placed under compression by housing members to cause an electrical interconnection between the filters and the ground plane through the gasket while absorbing any shock that may be imparted to the filters from the pins. The housing members are identical and are provided with polarizing means, latching means, and the like, as necessary.

REFERENCES:
patent: 3539973 (1970-11-01), Antes et al.
patent: 3701285 (1973-01-01), Schor et al.
patent: 3703701 (1972-11-01), Zimmerman, Jr.
patent: 3721869 (1973-03-01), Paoli
patent: 3743978 (1973-07-01), Fritz
patent: 3854107 (1974-12-01), Tuchto et al.
patent: 4178051 (1979-12-01), Kocher et al.
patent: 4187481 (1980-02-01), Boutros
patent: 4212510 (1980-07-01), Ritchie et al.

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