Solderless electrical interconnection including metallized hook

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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174261, 361749, 361772, 361776, 361779, 439 74, 439290, H01R 909, H05K 702

Patent

active

057743410

ABSTRACT:
A solderless electrical interconnection is made using electrically conductive hook fasteners (15) that are embedded in a substrate (12). The upper part (20) of the fastener is exposed on the top side of the substrate, the central part (22) is embedded within the substrate itself, and the lower or hook portion (17) of the fastener protrudes from the bottom side of the substrate. Electrically conductive pathways (30), defined on the top side of the substrate, make contact with the exposed upper part of the hook fastener. The electrically conductive runners on the top side have a continuous signal path through the substrate to the bottom side of the substrate via the electrically conductive hook fastener. The hook fastener (15) is engaged to electrically conductive loop fasteners (60) on a second substrate (70) in order to create a solderless electrical interconnection and mechanical interlocking between the two substrates.

REFERENCES:
patent: 3585569 (1971-06-01), Moran
patent: 3842189 (1974-10-01), Southgate
patent: 4191950 (1980-03-01), Levin et al.
patent: 4239046 (1980-12-01), Ong
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 5136470 (1992-08-01), Sheridon et al.
patent: 5457610 (1995-10-01), Bernardoni et al.
patent: 5561594 (1996-10-01), Wakefield

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