Geometrical instruments
Patent
1985-03-07
1986-09-09
McQuade, John
Geometrical instruments
29873, 339 17F, 339176MF, H01R 909
Patent
active
046104950
ABSTRACT:
A solderless connection method and apparatus is presented wherein means are provided to either gradate or minimize the change in impedance between the contact portions of circuits which are to be connected therein. In a first embodiment of the present invention, a solderless electrical connector is provided in which impedance is gradated between the two different characteristic impedances of the circuits which are to be connected. The procedure for carrying out such a gradual change in impedance is the change in dielectric constant caused by compression of a shaped cellular polymeric material. In a second embodiment, a solderless electrical connection is provided which applies even pressure across the circuit element, but which also has a low dielectric constant. Such a connector includes syntactic foam produced by adding hollow microspheres, such as glass or silica microspheres, to an elastomer.
REFERENCES:
patent: 3612744 (1971-10-01), Thomas
patent: 3643201 (1972-02-01), Harwood
patent: 3651432 (1972-03-01), Henschen et al.
patent: 4382236 (1983-05-01), Suzuki
patent: 4443657 (1984-04-01), Hill et al.
patent: 4468074 (1984-08-01), Gordon
McQuade John
Rogers Corporation
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