Solderless connection technique and apparatus

Details Solderless connection technique and apparatus Solderless connection technique and apparatus

1979-04-30

1984-08-28

Desmond, Eugene F.

Geometrical instruments

335 17CF, H01R 2372

Patent

active

044680740

ABSTRACT:
Contact portions of a first array of conductive elements are urged against mating contacts of a second array by a pressure applicator comprising a resilient open celled plastic material to establish and maintain an electrical connection therebetween.

REFERENCES:
patent: 3335327 (1967-08-01), Damon et al.
patent: 3701964 (1972-10-01), Cronin
patent: 3825878 (1974-07-01), Finger et al.
patent: 3874768 (1975-04-01), Cutchaw
patent: 3977756 (1976-08-01), Rodondi
patent: 3988648 (1976-10-01), Robinson
patent: 3998512 (1976-12-01), Anhalt et al.
patent: 4164003 (1979-08-01), Cutchaw
patent: 4166665 (1979-09-01), Cutchaw

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