Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping
Reexamination Certificate
2005-06-28
2005-06-28
Pham, Long (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Device held in place by clamping
C257S678000, C257S686000, C257S693000, C257S704000, C257S710000, C257S730000
Reexamination Certificate
active
06911731
ABSTRACT:
The electrodes of a light emitting diode (LED) is coupled to the terminals of a package with solderless pressure contacts. Each package is housed in a module with a bed on which the bottom electrode of the LED rests, and a pressure plate which is coupled to the top electrode of the LED. The pressure plate slides along four vertical posts to exert pressure to an LED package against a bed to form solderless pressure contacts. A plurality of LED packages can be lined up in a row to form a light strip, with the top pressure plate extended to form the bed of an adjacent module. A plurality of LED packages can also be arranged a matrix array display panel, where a plurality of lower terminals rests on one row of common bed of a number of parallel horizontal common beds, and where a plurality of upper terminals are pressed under a column of parallel vertical common pressure plates, so that any individual LED at the cross-point of a common bed and a common pressure can be randomly accessed.
REFERENCES:
patent: 5329437 (1994-07-01), Briggs
patent: 5617131 (1997-04-01), Murano et al.
patent: 6583444 (2003-06-01), Fjelstad
patent: 6707069 (2004-03-01), Song et al.
Lin Patent Agent H. C.
Louie Wai-Sing
Pham Long
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