Wave transmission lines and networks – Long line elements and components – Connectors and interconnections
Reexamination Certificate
1998-10-26
2001-09-18
Lee, Benny (Department: 2817)
Wave transmission lines and networks
Long line elements and components
Connectors and interconnections
C361S787000, C361S789000
Reexamination Certificate
active
06292073
ABSTRACT:
STATEMENT OF GOVERNMENT INTEREST
The invention described herein may be manufactured and used by or for the Government for governmental purposes without the payment of any royalty thereon.
BACKGROUND OF THE INVENTION
Field of the Invention
This invention relates to a circuit connection, particularly a solderless circuit interconnect.
The present invention relates to the field of radio frequency (RF) connectors. Prior art solderless methods used to connect microstrip substrates to stripline circuits include the use of clips which are used as a connection between pins on each circuit. Another known method includes the use of spring fingers soldered to the stripline circuit which makes contact with a pad etched on the transition piece epoxy board which is soldered to the microstrip substrate. Both of these methods provide undesirable narrow band transmissivities and tend to have more insertion loss than wanted, due to radiation.
SUMMARY OF THE INVENTION
The need for a low loss, broadband RF solderless interconnect for solid-state systems which require the quick removal and replacement of microstrip or stripline circuits is filled by the present invention.
The preferred design has a much better continuous fifty ohm path than the aforesaid spring finger method together with better grounding, which allows for lower loss and wideband performance. A spring bellows acts both as a central conductor of a fifty ohm coax and a connector contact member, while an aluminum backing of the microstrip module has a hole coaxially surrounding, the spring bellows. The annular hole in the aluminum backing acts as the outer coax conductor and the initial portion of the stripline circuit board. The machining of the aluminum backing creates a continuous ground path through the transition, thereby reducing the effects of radiation loss.
REFERENCES:
patent: 3795884 (1974-03-01), Kotaka
patent: 4509099 (1985-04-01), Takamatsu et al.
patent: 4816791 (1989-03-01), Carnahan et al.
patent: 5495395 (1996-02-01), Yoneda et al.
patent: 5552752 (1996-09-01), Stardivant et al.
patent: 5675302 (1997-10-01), Howard et al.
patent: 5886590 (1999-03-01), Quan et al.
patent: 6028498 (2000-02-01), Bickford
patent: 4291501 (1992-10-01), None
Lee Benny
Stover Thomas C.
The United States of America as represented by the Secretary of
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