Solderless capillary chips

Details Solderless capillary chips Solderless capillary chips

1979-07-12

1981-05-26

Ansher, Harold

Stock material or miscellaneous articles

Decorative article

Constructed from filamentary or flat sheet material

63 32, 428 28, 428134, 428702, B32B 106, A44C 1700

Patent

active

042699002

ABSTRACT:
A solderless capillary chip formed of a corundum-system precious stone such as ruby or sapphire, for use in electrical windings and the like. The inner bore of the chip is enlarged adjacent the exit end thereof, to permit relaxation of the wire to be pressure-bonded and thereby provide an improved contact situation for the next pressure-bonding operation.

REFERENCES:
patent: 2087470 (1937-07-01), Davidson et al.
patent: 2282336 (1942-05-01), Meyer
patent: 2353744 (1944-07-01), Meyer
patent: 4039726 (1977-08-01), Carr et al.
patent: 4081972 (1978-04-01), Kotlar

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