Soldering to a gold member

Details Soldering to a gold member Soldering to a gold member

1978-06-01

1981-05-19

Smith, John D.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

174 685, 228180R, 228180A, 228263R, 427 96, 427125, 4273744, 4273768, 427404, 428209, 428672, 428901, 428621, 428624, 428647, H05K 109, H05K 312, H05K 328, H05K 334

Patent

active

042685850

ABSTRACT:
A method of applying solder to gold by applying a gold-tin intermediate layer to the gold and applying the solder over at least a portion of the intermediate layer. The method can be employed to produce a printed circuit unit composed of a printed circuit board, at least one gold member mounted on the board, a gold-tin intermediate layer bonded to at least a portion of the gold member, and solder bonded onto the intermediate layer.

REFERENCES:
patent: 2220961 (1940-11-01), Kern
patent: 3160798 (1964-12-01), Lootens
patent: 3205297 (1965-09-01), Brock
patent: 3207838 (1965-09-01), McCormack
patent: 3209450 (1965-10-01), Klein
patent: 3472653 (1969-10-01), Short
patent: 3583063 (1971-06-01), Growney
patent: 3645785 (1972-02-01), Hentzschel
patent: 3660632 (1972-05-01), Leinkram
patent: 3716907 (1973-02-01), Anderson
patent: 3809797 (1974-05-01), McMunn
patent: 4077854 (1978-03-01), Estep

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