Soldering techniques employing a snap bar

Details Soldering techniques employing a snap bar Soldering techniques employing a snap bar

1993-06-23

1996-05-21

Schwartz, Larry I.

Metal fusion bonding

Process

Plural joints

228215, 228260, B23K 108, H05K 334

Patent

active

055181651

ABSTRACT:
Methods of soldering circuit boards are provided in which a snap bar is provided on the conductor side of a printed circuit board for reducing defects, such as bridging, during mass soldering. This and other provided process and design techniques, such as lead lengths, orientation, mask finish, and the location of the leads on the board, have significantly reduced reworking and defective components and are especially effective when applied to 50 mil connector products.

REFERENCES:
patent: 4339784 (1982-07-01), Shearer
patent: 4360144 (1982-11-01), Cuddy et al.
patent: 4803308 (1989-02-01), Taguchi
patent: 4835345 (1989-05-01), Haarde
patent: 5242100 (1993-09-01), Weeks

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