Soldering technique

Details Soldering technique Soldering technique

1983-07-25

1986-03-18

Albritton, C. L.

Electric heating

Metal heating

For bonding with pressure

219234, 219 85CM, B23K 104

Patent

active

045770832

ABSTRACT:
A solder application method and apparatus in which the solder element to be melted onto members to be electrically interconnected is the resistive heating element part of the solder heating circuit. A probe is provided for engagement with conductive metal associated with the area to be soldered and the solder to be melted onto the area to be soldered. This probe projects from the same housing to the area to be soldered and thereby establishes a heating circuit through the area to be soldered and through the solder. The melting of a predetermined length of solder and the dropping thereof onto the area to be soldered opens the circuit and terminates the soldering operation. Various controls may be utilized to control the amount of current, the amount of voltage, the current flow at which the soldering operation will begin, and the shaped of any particular current or voltage pulse; but an essential element is that the soldering operation commences when the probe and the solder both engage the work and terminates on the melting of the solder thereby providing automatic simplified control; and another essential element is that the solder used in the splice is the significant resistance and heating element itself rather than having external heat applied to that solder.

REFERENCES:
patent: 1248812 (1917-12-01), Costello
patent: 2789198 (1957-04-01), Dye et al.
patent: 3119006 (1964-01-01), Faulconer

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