Soldering system and method of using same

Details Soldering system and method of using same Soldering system and method of using same

1990-02-23

1991-07-23

Heinrich, Samuel M.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228105, 228 62, 228 491, B23K 3704, B23K 300

Patent

active

050336657

ABSTRACT:
A soldering system includes a visualization station disposed in relatively close proximity to the final resting position of a circuit element to be soldered, and a back lighted head arrangement for helping transport the circuit element to the visualization station, and for helping facilitate the clear visualization of the element so that its position may be adjusted for possible misalignment at the time of its placement at the final position.

REFERENCES:
patent: 4737845 (1988-04-01), Susuki et al.
patent: 4832250 (1989-05-01), Spigarelli et al.
Surface Mount Technology, "How to Use Integral Vision and Reflow for Placement of Fine Pitch SMCs", pp. 31, 32, Feb. 1987.
IBM Technical Disclosure Bulletin "Assembly Technique for Placing Electronic Components . . . ", vol. 31, No. 10, pp. 222-228, Mar. 1989.

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