Soldering structure between a tab of a bus bar and a printed...

Details Soldering structure between a tab of a bus bar and a printed... Soldering structure between a tab of a bus bar and a printed...

2006-02-14

2006-02-14

Ta, Tho D. (Department: 2833)

Electrical connectors

Including overstress preventing means

C439S721000, C439S949000, C439S082000, C439S083000, C439S876000

Reexamination Certificate

active

06997737

ABSTRACT:
A soldering structure between a tab of a bus bar and a printed substrate is disclosed to provide a soldering structure between a tab of a bus bar and a printed substrate that causes no crack. An electrical conductive material is formed on a printed substrate. A tab through-hole is provide to penetrate the electrical conductive material and printed substrate. A tab formed by bending a body of the bus bar enters the tab through-hole. A periphery of the tab and the electrical conductive material are interconnected by soldering. A stress-absorbing aperture or recess is provided in an insulation plate on which the body of the bus bar is mounted. The stress-absorbing aperture or recess can absorb an axial stress caused in the tab.

REFERENCES:
patent: 4193660 (1980-03-01), Jaconette
patent: 4558912 (1985-12-01), Coller et al.
patent: 5984691 (1999-11-01), Brodsky et al.
patent: A 10-189085 (1998-07-01), None
patent: A 2000-22353 (2000-01-01), None

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