Soldering process

Details Soldering process Soldering process

2011-01-04

2011-01-04

King, Roy (Department: 1793)

Metal fusion bonding

Process

Applying or distributing fused filler

C228S037000, C228S256000, C228S034000

Reexamination Certificate

active

07861915

ABSTRACT:
A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.

REFERENCES:
patent: 3058441 (1962-10-01), Walker et al.
patent: 3445919 (1969-05-01), Saba
patent: 3616984 (1971-11-01), Voroba
patent: 3627696 (1971-12-01), Heithaus et al.
patent: 3724418 (1973-04-01), McLain
patent: 3755886 (1973-09-01), Hermann
patent: 3888639 (1975-06-01), Hastings et al.
patent: 3966110 (1976-06-01), Boynton
patent: 4092182 (1978-05-01), Arbib et al.
patent: 4171761 (1979-10-01), Boldt et al.
patent: 4243440 (1981-01-01), Arbib et al.
patent: 4441924 (1984-04-01), Arbib et al.
patent: 4495007 (1985-01-01), Zado
patent: 4561913 (1985-12-01), Zado
patent: 4598858 (1986-07-01), Stratil et al.
patent: 5176307 (1993-01-01), Hagerty et al.
patent: 5575863 (1996-11-01), Sala et al.
patent: 5833921 (1998-11-01), Paruchuri et al.
patent: 6648216 (2003-11-01), Yamaguchi et al.
patent: 6805282 (2004-10-01), Kawashima et al.
patent: 2006/0054668 (2006-03-01), Severin
patent: 0 938 944 (1999-01-01), None
patent: 408736 (1973-11-01), None
patent: 2116172 (1998-07-01), None
Product Brochure: AIM;Lead-free Soldering Guide; 60 pages (2003).
Internet Product Brochure: Kester;Flux and Solder Paste Considerations for Lead-Free Soldering; 3 pages (2005).
Product Brochure: ALTERA®;Reflow Soldering Guidelines for Lead-Free Packages; Copyright Jul. 2004, Version 1.0, Application Note 353; 8 pages (2004).
Sichuan Institute of Electronics, “Surface Mount Technology Process and Materials”, published by Surface Mount Technology Professional Council of Sichuan Institute of Electronics, Chapter 4, Sections 4.8.3-4.8.5, pp. 79-81, Concise Explanation of Relevance; English translation, Chapter 4, Solders and Antioxidant Oils, 4.8.3-4.8.5, 4 pages) (1999).
International Search Report for PCT application PCT/US2005/013153, Search Report dated Nov. 2, 2005, 4 pages (2005).

Affiliated with

Also associated with

Rating

Soldering process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldering process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2662038