Soldering process

Details Soldering process Soldering process

1994-10-03

1997-03-18

Bradley, P. Austin

Metal fusion bonding

Process

Plural joints

228259, 427433, H05K 334

Patent

active

056114800

ABSTRACT:
In a soldering process leads of components on a circuit board are dipped into a solder bath to solder them to the underside of the board. The board is rotated about a horizontal axis as it is lifted away from the bath. This reduces the tendency to form solder bridges between closely spaced leads.

REFERENCES:
patent: 2870532 (1959-01-01), Young
patent: 3056371 (1962-10-01), Frank
patent: 3059604 (1962-10-01), Brandys
patent: 3499220 (1970-03-01), Hintz et al.
patent: 4869418 (1989-09-01), Simpson et al.

Affiliated with

Also associated with

Rating

Soldering process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldering process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1700278