Soldering process

Details Soldering process Soldering process

1994-12-19

1995-07-04

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

2282481, 228254, 427123, H05K 334

Patent

active

054292930

ABSTRACT:
A soldering process uses two or more different solder alloys. A first solder alloy (115) that undergoes a solid-to-liquid transition at a first temperature is coated (20) onto the solderable surfaces (105) of a printed circuit board (100). A solder paste (120) that undergoes this solid-to-liquid transition at a temperature greater than the first temperature is deposited on the coated solderable potions, and is heated to a temperature that is above the first temperature but below the second temperature. During this time, the first solder alloy liquifies, while the solder paste does not. The first solder alloy wets to the individual particles in the solder paste, and alloys to the solderable surfaces and the solder particles in the solder paste. The soldering composition is subsequently cooled (40) to solidify the first solder material, forming a solid and substantially planar coating on the solderable potions of the printed circuit board.

REFERENCES:
patent: 5024372 (1991-06-01), Altman et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5233504 (1993-08-01), Melton et al.
"New Techniques Eliminate Solder Paste From Printed Circuit Assembly Operation," Holzmann, D. and Payne, B., Mask Technology, Inc., Santa Ana, Calif., Surface Mount International Conference and Exposition, Proceedings of the Technical Program, San Jose, Calif., Sep., 1992.
"SIPAD--A New Reflow Soldering Method for SMD's using a Solid Solder Deposit," Maiwald, W., Siemens AG, Munich, Germany, Surface Mount International Conference and Exposition, Proceedings of the Technical Program, San Jose, Calif., Aug. 1991.

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