Soldering process

Details Soldering process Soldering process

1994-01-18

1995-07-25

Rosenbaum, Mark

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228 36, B23K 120

Patent

active

054354811

ABSTRACT:
A soldering process for use with solder clad printed circuit boards (10) uses a pin transfer means to apply a tacking agent to the substrate. An array of pins (24) is dipped into a film of tacking agent (22). The pins are removed from the tacking agent (26) carrying with them a predetermined amount of tacking agent. The pins are then contacted (27) to the printed circuit board and removed (28). During this process, a predetermined amount of tacking agent is deposited at selective locations on the printed circuit board. A component is placed (30) on the printed circuit board in the tacking agent and the circuit board and component are heated (40) in order to reflow the solder and effect the solder joint between the component and the board.

REFERENCES:
patent: 3034478 (1962-05-01), Schwartz
patent: 4239576 (1980-12-01), Taki et al.
patent: 4720324 (1988-01-01), Hayward
patent: 5177134 (1993-01-01), Mullen et al.
patent: 5203075 (1993-04-01), Angulas et al.
IBM Technical Disclosure Bulletin, "Automatic Flux Applicator", vol. 34, No. 2, Jul. 1991, pp. 356-357.

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