Soldering pot

Details Soldering pot Soldering pot

1993-10-19

1995-05-02

Bradley, P. Austin

Metal fusion bonding

Including means to apply flux or filler to work or applicator

With means to skim dross

228 37, 228 562, B23K 306

Patent

active

054111978

ABSTRACT:
A flow of waste fused solder, which has been ejected from ejection nozzles 2, 3 but has not been effectively used during a soldering process, is received in troughs 10 provided on either sides of each of the ejection nozzles 2, 3. The flow of waste fused solder, containing therein oxides, is directed through the troughs 10 into a filtration chamber 13 defined in a vessel body 1. The flow of fused solder is filtrated by means of a partition plate 12 as it flows from the filtration chamber 13 into a solder reservoir 14, so that the oxides in the fused solder are removed. The troughs 10 do not become clogged with the oxides in the fused solder, since the top each of the troughs is opened. Due to an appropriate configuration of the partition plate 12, depending upon difference in specific gravity between the fused solder and the oxides, it is possible to effectively remove oxides from the solder ejection vessel.

REFERENCES:
patent: 4981249 (1991-01-01), Kawashima et al.

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