Soldering pins into printed circuit boards

Details Soldering pins into printed circuit boards Soldering pins into printed circuit boards

1987-11-25

1989-10-31

Rowan, Kurt

Metal fusion bonding

Process

With shaping

2281801, B23K 3102

Patent

active

048771767

ABSTRACT:
Soldering splined pins into holes in printed circuit boards by providing small volumetric gaps between the splines to allow thin layers of solder lining, the holes to be sufficiently thick to block the gaps during solder flow. The solder may have a maximum thickness of 0.001 inches to block the gaps unassisted by additional solder.

REFERENCES:
patent: 497801 (1893-05-01), Le Gresley-Cox
patent: 3834015 (1974-09-01), DiRenzo
patent: 3977075 (1976-08-01), Lynch
patent: 4011980 (1977-03-01), Dvorak
patent: 4050621 (1977-09-01), Bouley
patent: 4373259 (1983-02-01), Motsch
patent: 4420877 (1983-12-01), McKenzie

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