Soldering paste for light beam-heating soldering

Metal treatment – Compositions – Fluxing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148 23, 148 25, B23K 3534

Patent

active

052345084

ABSTRACT:
A soldering paste for light beam-heating soldering containing a flux which contains 2 to 8 % by weight of a thixotropic agent having a melting point of 140.degree. to 150.degree. C., 1.8 to 3.0 % by weight of an activator containing cyclohexylamine hydrobromide, 40 to 50 % by weight of a rosin component and 40 to 50 % by weight of a solvent; and spherical solder particles having a particle size of 250 to 400 mesh and an oxygen content of not larger than 200 ppm, in which a content of the flux in the soldering paste is from 9 to 13 % by weight and the soldering paste has a thixotropy index of 7 to 8.

REFERENCES:
patent: 3684533 (1972-08-01), Conwicke
patent: 4568395 (1986-02-01), Nabhani
patent: 4759490 (1988-07-01), Ochiai

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Soldering paste for light beam-heating soldering does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldering paste for light beam-heating soldering, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering paste for light beam-heating soldering will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1722580

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.