Soldering methods and devices

Details Soldering methods and devices Soldering methods and devices

1987-08-25

1989-03-07

Lin, Kuang Y.

Metal fusion bonding

Solder form

148 23, B23L 3536

Patent

active

048099015

ABSTRACT:
A heat-recoverable soldering device comprises a heat-recoverable member having a fusible solder insert and associated with the solder insert, a solder flux composition which undergoes a visible color change at a critical temperature. Solderable substrates are positioned within the device and heated until a critical temperature has been reached as indicated by a color change in the flux. The critical temperature depends on the material of the particular heat-recoverable member and the solder used. It is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Novel flux compositions and their use in soldering are also disclosed.

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