Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1981-10-05
1985-03-19
Lin, Kuang Y.
Metal fusion bonding
Process
With protecting of work or filler or applying flux
228103, 148 23, B23K 3536
Patent
active
045054215
ABSTRACT:
A heat-recoverable soldering device comprises a heat-recoverable member having a fusible solder insert and associated with the solder insert, a solder flux composition which undergoes a visible color change at a critical temperature. Solderable substrates are positioned within the device and heated until a critical temperature has been reached as indicated by a color change in the flux. The critical temperature depends on the material of the particular heat-recoverable member and the solder used. It is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Novel flux compositions and their use in soldering are also disclosed.
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Cydzik Edward A.
Gen Tamar G.
Burkard Herbert G.
Lin Kuang Y.
Raychem Corporation
Rice Edith A.
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