Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent
1984-04-13
1987-05-26
Lin, Kuang Y.
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
228224, 148 23, B23K 3536
Patent
active
046678697
ABSTRACT:
A heat-recoverable soldering device comprises a heat-recoverable member containing a fusible solder insert, solder flux and a thermochromic composition which undergoes a visible change from a colored to a colorless state at the soldering temperature. Solderable substrates are positioned within the device and heat is applied until the soldering temperature has been reached, as indicated by a color change of the thermochromic composition. The soldering temperature is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Typically this temperature is at least about 20.degree. C. above the melting temperature of the solder.
REFERENCES:
patent: 2027962 (1936-01-01), Currie
patent: 3086242 (1963-04-01), Cook et al.
patent: 3087238 (1963-04-01), Nottingham
patent: 3239125 (1966-03-01), Sherlock
patent: 3305625 (1967-02-01), Ellis
patent: 3316343 (1967-04-01), Sherlock
patent: 3396460 (1968-08-01), Wetmore
patent: 3396894 (1968-08-01), Ellis
patent: 3451609 (1969-06-01), Gillett
patent: 3730782 (1973-05-01), Poliak et al.
patent: 3957382 (1976-05-01), Greuel et al.
patent: 4090655 (1978-05-01), Tissot
patent: 4137369 (1979-01-01), Chaikin
patent: 4207364 (1980-06-01), Nyberg
patent: 4228761 (1980-10-01), Glover et al.
patent: 4304959 (1981-12-01), Vidakovits et al.
patent: 4344909 (1982-08-01), DeBlauwe
patent: 4505421 (1985-03-01), Gen et al.
"Crayons, Paints, Labels Tell Part Temperature" Welding Design and Fabrication, Dec. 1981, p. 82.
"Transparent Flip Chip for Monitoring Flux Cleaning" IBM Technical Disclosure Bulletin, vol. 18, No. 10, Mar. 1976, p. 3231.
"One-Shot Temperature Indicators"-Assembly Engineering (Dec. 1979, pp. 14-15).
Cydzik Edward A.
Gen Tamar G.
Burkard Herbert G.
Lin Kuang Y.
Raychem Corporation
Rice Edith A.
LandOfFree
Soldering methods and devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Soldering methods and devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering methods and devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-698231