Soldering methods and apparatus

Details Soldering methods and apparatus Soldering methods and apparatus

1980-12-15

1983-06-28

Sipos, John

Metal fusion bonding

Process

Plural joints

228 20, 228 46, 228222, H05K 334, B23K 108

Patent

active

043901204

ABSTRACT:
Apparatus augmenting a wave soldering machine for mitigating warpage of a printed wiring board after it is processed by the soldering machine comprises heat dissipation means (200) and cooling means (202). The dissipation means directs a first gaseous stream over the a narrow, transverse strip on the underside of the board as it exits a crest of molten solder supplied by the soldering machine. The stream solidifies any liquid solder without disturbing the solder joints. The cooling means directs a second gaseous stream to substantially the centerline region of the board as it exits the dissipation means. The seriatim arrangement of heat reduction means produces a cooling characteristic which is the inverse of the temperature characteristic caused by the soldering operation.

REFERENCES:
patent: 1756947 (1930-05-01), Johnston
patent: 3500536 (1970-03-01), Goldshmied
patent: 3605244 (1971-09-01), Osborne
patent: 3607366 (1971-09-01), Kitakyushu
patent: 3874068 (1975-04-01), Cook
patent: 3998181 (1976-12-01), Bellen
patent: 4277518 (1981-07-01), Schillke

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