Soldering method using localized heat source

Details Soldering method using localized heat source Soldering method using localized heat source

1987-12-18

1988-11-15

Albritton, C. L.

Electric heating

Metal heating

By arc

219 85BA, 219 85BM, 21912163, B23K 2600

Patent

active

047851562

ABSTRACT:
In one embodiment (FIG. 1) leads (14) are soldered to bonding pads (11) by heating a silica heating member (17) with a laser beam (16). The heating member has a tubular shape and encloses the solder elements to be heated. In another embodiment (FIG. 3), the heating element is a plate (22) overlying elements to be soldered which plate is scanned by a laser beam (28) along a line (31) in close proximity to the elements to be soldered.

REFERENCES:
patent: 3283124 (1966-11-01), Kawecki

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