Soldering method for semiconductor optical device, and...

Details Soldering method for semiconductor optical device, and... Soldering method for semiconductor optical device, and...

2005-05-18

2008-08-26

Lee, Hsien-ming (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C438S023000, C438S026000, C257S098000, C257S100000

Reexamination Certificate

active

07416906

ABSTRACT:
A method for soldering a semiconductor optical device including a resin-made optical lens to an object by a reflow soldering process using a lead-free solder, and a semiconductor optical device for use in the method. A semiconductor optical device including a silicone resin-made optical lens as the resin-made optical lens is used.

REFERENCES:
patent: 6953952 (2005-10-01), Asakawa
patent: 2005/0237868 (2005-10-01), Nabe et al.
patent: 2006/0012967 (2006-01-01), Asai et al.
patent: 1 249 874 (2002-10-01), None
patent: 4-127667 (1992-11-01), None
patent: 11-222555 (1999-08-01), None
patent: 2001-203395 (2001-07-01), None
patent: 2002-280604 (2002-09-01), None
patent: 2004-146554 (2004-05-01), None

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