Soldering method for printed circuit board

Details Soldering method for printed circuit board Soldering method for printed circuit board

1987-02-24

1989-04-11

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

2281802, 228256, A05K 334

Patent

active

048193275

ABSTRACT:
This invention relates to a method of soldering electronic components for a printed circuit board by dipping the printed circuit board into a molten solder inside a soldering bath. When the printed circuit board is dipped into the molten solder inside the soldering bath, it is dipped together with a member that attracts the molten solder, and when the printed circuit board is pulled up from the molten solder, it is pulled up while the edge of the member keeps contact with a solder connection portion of the printed circuit board. After the printed circuit board is pulled from the molten solder, the edge of the member is separated from the printed circuit board to remove any excessive solder adhering to the connection portion by the surface tension of the solder.

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