Soldering method for mounting semiconductor device on wiring...

Details Soldering method for mounting semiconductor device on wiring... Soldering method for mounting semiconductor device on wiring...

2011-01-04

2011-01-04

Ward, Jessica L (Department: 1793)

Metal fusion bonding

Process

Plural heat applying

C228S127000, C228S233100, C228S234100, C228S235100, C228S102000, C228S103000, C156S311000, C156S580000, C156S583100, C156S583200, C029S738000, C029S739000, C029S740000, C438S005000, C438S106000

Reexamination Certificate

active

07861913

ABSTRACT:
In a soldering method for mounting a semiconductor device on a wiring board, a plurality of solid-phase solders are provided between the semiconductor device and the wiring board, and are thermally melted to thereby produce a plurality of liquid-phase solders therebetween. A constant force is exerted on the liquid-phase solders by relatively moving the semiconductor device with respect to the wiring board so that an invariable gap is determined between the semiconductor device and the wiring board.

REFERENCES:
patent: 6131795 (2000-10-01), Sato
patent: 2003-31993 (2003-01-01), None
Chinese Office Action dated May 16, 2008, with an English translation.

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