Metal fusion bonding – Process – With shaping
Reexamination Certificate
2005-10-11
2005-10-11
Edmondson, Lynne R. (Department: 1725)
Metal fusion bonding
Process
With shaping
C228S180220, C228S180500, C228S246000, C438S612000, C438S613000
Reexamination Certificate
active
06953145
ABSTRACT:
A method is proposed for fastening at least one electrical component to a substrate using solder, in which elevations are produced in the solder substrate, the elevations being at least as high as the thickness of a solder layer to be produced. In another step, the solder is laid upon the elevations, and in a further step, the elevations are pressed down until they have reached approximately the height of the solder, so that a soldering procedure may follow. The method is used for producing exactly specified thicknesses of solder layers having tolerances less than 10 micrometers.
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Meinders Horst
Urbach Peter
Wallrauch Alexander
Will Barbara
Wolf Kuno
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