Soldering method for electric and or electronic components

Details Soldering method for electric and or electronic components Soldering method for electric and or electronic components

1981-08-05

1984-02-28

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

228 37, 228259, H05K 334

Patent

active

044338058

ABSTRACT:
Compressed air is blown into a pool of molten solder during soldering to form air bubbles which rapidly rise in the molten solder toward the top. The rising air bubbles strike against a printed circuit board and electric and or electronic components temporarily fixed thereto to achieve soldering. After soldering, inert gas is introduced into the molten solder instead of the air.

REFERENCES:
patent: 3705457 (1972-12-01), Tardoskegyi
patent: 3874068 (1975-04-01), Cook
patent: 4019671 (1977-04-01), Akyuerek
patent: 4375271 (1983-03-01), Tsuchikura

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