Soldering method for electric and or electronic component

Metal fusion bonding – Process – Plural joints

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228259, 228 37, H05K 334

Patent

active

043752713

ABSTRACT:
A soldering method comprises forming bubbles by blowing gas into a pool of molten solder, and striking the bubbles against a printed circuit board with electric and or electronic components temporarily fixed thereto to solder them to each other.

REFERENCES:
patent: 3589590 (1971-06-01), Fitzsimmons
patent: 3705457 (1972-12-01), Tardoskegyi
patent: 4019671 (1977-04-01), Akyuerek

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